PC87570 datasheet(13/168 Pages) NSC

13 / 168 page

Table of Contents

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18.4

MONITORING ACTIVITY DURING DEVELOPMENT ............................................................. 130

18.4.1

The Bus Status Signals ............................................................................................. 130

18.4.2

Transaction Effects on the External Bus ................................................................... 130

18.4.3

Pipe Status Signals ................................................................................................... 131

18.5

DEVELOPMENT SYSTEM REGISTERS ................................................................................ 131

18.5.1

Debug Configuration Register (DBGCFG) ................................................................ 131

18.5.2

Debug Freeze Enable Register (DBGFRZEN) .......................................................... 131

19.0

Device Specifications

19.1

POWER AND GROUNDING ................................................................................................... 132

19.2

GENERAL DC ELECTRICAL CHARACTERISTICS ............................................................... 132

19.2.1

Recommended Operating Conditions ....................................................................... 132

19.2.2

Absolute Maximum Ratings ....................................................................................... 133

19.2.3

Power Supply Current under Recommended Operating Conditions ......................... 133

19.3

DC ELECTRICAL CHARACTERISTICS ................................................................................. 134

19.3.1

Analog ....................................................................................................................... 134

19.3.2

Digital ......................................................................................................................... 135

19.4

AC ELECTRICAL CHARACTERISTICS .................................................................................. 137

19.4.1

Definitions .................................................................................................................. 137

19.4.2

Timing Tables ............................................................................................................ 138

19.5

TIMING DIAGRAMS ................................................................................................................ 144

19.5.1

General ...................................................................................................................... 144

19.5.2

BIU ............................................................................................................................. 146

19.5.3

GPIO Ports ................................................................................................................ 149

19.5.4

Host Interface ............................................................................................................ 150

19.5.5

MFT16 ....................................................................................................................... 151

19.5.6

ACCESS Bus Interface .............................................................................................. 152

19.5.7

Dev Environment Support ......................................................................................... 153

19.5.8

Interrupts and Wake-up ............................................................................................. 153

19.5.9

Reset ......................................................................................................................... 154

19.5.10 Host Power-on ........................................................................................................... 154

19.5.11 PS/2 Interface ............................................................................................................ 155

CR16A Register Map

Bootloader Description

B.1

OVERVIEW ............................................................................................................................. 164

B.2

CONFIGURATION BLOCKS ................................................................................................... 164

B.2.1

System Configuration Block ...................................................................................... 164

B.2.2

KBC Header .............................................................................................................. 164

B.3

SYSTEM RESOURCES USED BY BOOTLOADER ............................................................... 164

B.3.1

GPIO Pins .................................................................................................................. 164

B.3.2

On-Chip RAM ............................................................................................................ 165

B.4

BOOTLOADER PROGRAM OPERATION .............................................................................. 165

PC87570 数据表(PDF) 13 Page - National Semiconductor (TI)

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