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L99MD02 数据表(PDF) 39 Page - STMicroelectronics |
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L99MD02 数据表(HTML) 39 Page - STMicroelectronics |
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39 / 46 page ![]() L99MD02 Package and PCB thermal data Doc ID 16082 Rev 5 39/46 9 Package and PCB thermal data 9.1 PowerSSO-36 thermal data Figure 12. PowerSSO-36 PC board Note: Board finish thickness 1.6 mm +/- 10%; Board double layer and four layers; Board dimension 129 mm x 60 mm; Board Material FR4; Cu thickness 0.070 mm (outer layers); Cu thickness 0.035mm (inner layers); Thermal vias separation 1.2 mm; Thermal via diameter 0.3 mm +/-0.08 mm; Cu thickness on vias 0.025 mm; Footprint dimension 4.1 mm x 6.5 mm |
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