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STM8L151C2 数据表(PDF) 13 Page - STMicroelectronics |
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STM8L151C2 数据表(HTML) 13 Page - STMicroelectronics |
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13 / 122 page ![]() DocID018780 Rev 9 13/122 STM8L151x2, STM8L151x3 Description 49 2.2 Ultra-low-power continuum The ultra-low-power low-density STM8L151x2/3 devices are fully pin-to-pin, software and feature compatible. Besides the full compatibility within the family, the devices are part of STMicroelectronics microcontrollers ultra-low-power strategy which also includes STM8L101xx and STM8L15xxx. The STM8L and STM32L families allow a continuum of performance, peripherals, system architecture, and features. They are all based on STMicroelectronics 0.13 µm ultra-low leakage process. Note: 1 The STM8L151xx and STM8L152xx are pin-to-pin compatible with STM8L101xx devices. Performance All families incorporate highly energy-efficient cores with both Harvard architecture and pipelined execution: advanced STM8 core for STM8L families and ARM® Cortex®-M3 core for STM32L family. In addition specific care for the design architecture has been taken to optimize the mA/DMIPS and mA/MHz ratios. This allows the ultra-low-power performance to range from 5 up to 33.3 DMIPs. Shared peripherals STM8L151xx/152xx and STM8L15xxx share identical peripherals which ensure a very easy migration from one family to another: • Analog peripherals: ADC1 and comparators COMP1/COMP2 • Digital peripherals: RTC and some communication interfaces Common system strategy To offer flexibility and optimize performance, the STM8L151xx/152xx and STM8L15xxx devices use a common architecture: • Same power supply range from 1.8 to 3.6 V, down to 1.65 V at power down • Architecture optimized to reach ultra-low consumption both in low power modes and Run mode • Fast startup strategy from low power modes • Flexible system clock • Ultra-safe reset: same reset strategy for both STM8L15x and STM32L15xxx including power-on reset, power-down reset, brownout reset and programmable voltage detector. Features ST ultra-low-power continuum also lies in feature compatibility: • More than 10 packages with pin count from 20 to 100 pins and size down to 3 x 3 mm • Memory density ranging from 4 to 128 Kbyte |
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