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STM32F098CC 数据表(PDF) 107 Page - STMicroelectronics |
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STM32F098CC 数据表(HTML) 107 Page - STMicroelectronics |
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107 / 128 page  DocID026967 Rev 4 107/128 STM32F098CC STM32F098RC STM32F098VC Package information 124 Figure 40. Recommended footprint for UFBGA64 package ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 72. UFBGA64 recommended PCB design rules Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 71. UFBGA64 package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 |
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