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STM32F098CC 数据表(PDF) 110 Page - STMicroelectronics |
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STM32F098CC 数据表(HTML) 110 Page - STMicroelectronics |
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110 / 128 page  Package information STM32F098CC STM32F098RC STM32F098VC 110/128 DocID026967 Rev 4 Figure 43. Recommended footprint for WLCSP64 package b(2) 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 3.312 3.347 3.382 0.1304 0.1318 0.1331 E 3.550 3.585 3.620 0.1398 0.1411 0.1425 e - 0.400 - - 0.0157 - e1 - 2.800 - - 0.1102 - e2 - 2.800 - - 0.1102 - F - 0.2735 - - 0.0108 - G - 0.3925 - - 0.0155 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 74. WLCSP64 recommended PCB design rules Dimension Recommended values Pitch 0.4 Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed. Table 73. WLCSP64 package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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