STM32F101XF datasheet(8/117 Pages) STMICROELECTRONICS

8 / 117 page

List of figures

STM32F101xF, STM32F101xG

8/117

DocID16553 Rev 5

Figure 43.

I2C bus AC waveforms and measurement circuit(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Figure 44.

SPI timing diagram - slave mode and CPHA=0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

Figure 45.

SPI timing diagram - slave mode and CPHA=1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

Figure 46.

SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

Figure 47.

ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Figure 48.

Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

Figure 49.

Power supply and reference decoupling (VREF+ not connected to VDDA). . . . . . . . . . . . . . 96

Figure 50.

Power supply and reference decoupling (VREF+ connected to VDDA) . . . . . . . . . . . . . . . 97

Figure 51.

12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

Figure 52.

LQFP144 - 144-pin, 20 x 20 mm low-profile quad flat package outline . . . . . . . . . . . . . . 101

Figure 53.

LQFP144 - 144-pin, 20 x 20 mm low-profile quad flat package

footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Figure 54.

LQFP144 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

Figure 55.

LQFP100 – 14 x 14 mm, 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . 105

Figure 56.

LQFP100 - 100-pin, 14 x 14 mm low-profile quad flat

recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Figure 57.

LQFP100 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

Figure 58.

LQFP64 – 10 x 10 mm, 64 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . 108

Figure 59.

LQFP64 - 10 x 10 mm low-profile quad flat recommended footprint . . . . . . . . . . . . . . . . 109

Figure 60.

LQFP64 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

Figure 61.

LQFP64 PD max vs. TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

STM32F101XF 数据表(PDF) 8 Page - STMicroelectronics

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