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ST8034P 数据表(PDF) 33 Page - STMicroelectronics |
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ST8034P 数据表(HTML) 33 Page - STMicroelectronics |
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33 / 39 page ![]() Package information ST8034T, ST8034AT, ST8034P, ST8034C 34/40 DocID024587 Rev 4 Table 15. SO16 - 3.9 x 9.9 mm body package mechanical data Figure 20. Recommended footprint SO16 - 3.9 x 9.9 mm body Symbol Dimensions (mm) Notes Min. Typ. Max. A 1.75 A1 0.10 0.25 A2 1.25 b 0.31 0.51 c 0.17 0.25 D 9.80 9.90 10.00 (1) 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs should not exceed 0.15 mm in total (both sides). E 5.80 6.00 6.20 E1 3.80 3.90 4.00 (2) 2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions should not exceed 0.25 mm (per side). e 1.27 h 0.25 0.50 L 0.40 1.27 k 08 (3) 3. Degrees. ccc 0.10 |
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