8

bq40z50-R2

SLUSCS4 – JUNE 2017

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7.3 Recommended Operating Conditions

2.2 V to 26 V (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

BAT, VCC, PBI

2.2

26

V

Shutdown voltage

1.8

2.0

2.2

V

Start-up voltage

2.05

2.25

2.45

V

Shutdown voltage

hysteresis

250

mV

Input voltage range

PACK, SMBC, SMBD, PRES, BTP_IN, DISP

26

V

TS1, TS2, TS3, TS4

PTC, PTCEN, LEDCNTLA, LEDCNTLB, LEDCNTLC

SRP, SRN

–0.2

0.2

VC4

VC3

VC2

VC1

Output voltage

range

CHG, DSG, PCHG, FUSE

26

V

External PBI

capacitor

2.2

µF

Operating

temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

bq40z50-R2

UNIT

RSM (QFN)

32 PINS

Junction-to-ambient thermal resistance

47.4

°C/W

Junction-to-case(top) thermal resistance

40.3

°C/W

Junction-to-board thermal resistance

14.7

°C/W

Junction-to-top characterization parameter

0.8

°C/W

Junction-to-board characterization parameter

14.4

°C/W

Junction-to-case(bottom) thermal resistance

3.8

°C/W

7.5 Supply Current

2.2 V to 20 V (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

NORMAL mode

CHG on. DSG on, no Flash write

336

µA

SLEEP mode

CHG off, DSG on, no SBS communication

75

µA

CHG off, DSG off, no SBS communication

52

SHUTDOWN mode

1.6

µA