Pin Description

Pin Name

I/O

ROM Code

Option

Description

PA0~PA5

PA6/TMR0

PA7/TMR1

I/O

Pull-high

Wake-up

CMOS/NMOS/PMOS

Bidirectional 8-bit input/output port. Each bit can be configured as a

wake-up input by ROM code option. The input or output mode is con-

trolled by PAC (PA control register).

Pull-high resistor options: PA0~PA7

CMOS/NMOS/PMOS options: PA0~PA7

Wake up options: PA0~PA7

PA6 and PA7 are pin-shared with TMR0 and TMR1 input, respectively.

PB0~PB7

I/O

Pull-high

Wake-up

Bidirectional 8-bit input/output port. Software instructions determine

the CMOS output or Schmitt trigger input with pull-high resistor (deter-

mined by pull-high options).

Wake-up options: PB0~PB7

PD0~PD7

I/O

Pull-high

Wake-up

Bidirectional I/O lines. Software instructions determine the CMOS out-

put or Schmitt trigger input with pull-high resistor (determined by

pull-high options).

Wake-up options: PD0~PD7

VSS

¾¾

Negative power supply, ground

PC0~PC7

I/O

Pull-high

Wake-up

Bidirectional I/O lines. Software instructions determine the CMOS out-

put or Schmitt trigger input with pull-high resistor (determined by

pull-high options).

Wake-up options: PC0~PC7

RES

I

¾

Schmitt trigger reset input. Active low

VDD

¾¾

Positive power supply

V33O

O

¾

3.3V regulator output

USBD+/CLK

I/O

¾

USBD+ or PS2 CLK I/O line

USB or PS2 function is controlled by software control register

USBD-/DATA

I/O

¾

USBD- or PS2 DATA I/O line

USB or PS2 function is controlled by software control register

OSC1

OSC2

I

O

¾

OSC1, OSC2 are connected to a 6MHz or 12MHz Crystal/resonator

(determined by software instructions) for the internal system clock.

Absolute Maximum Ratings

Storage Temperature ............................

-50°Cto125°C

Operating Temperature...............................0

°Cto70°C

-100mA

Total Power Dissipation .....................................500mW

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed

in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

HT82K95EE/HT82K95AE

Rev. 1.50

3

April 13, 2012