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7782 数据表(PDF) 12 Page - STMicroelectronics

部件名 7782
功能描述  32 Mbit (2Mb x 16, Dual Bank, Burst ) 1.8V Supply Flash Memory
PDF  63 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

7782 数据表(HTML) 12 Page - STMicroelectronics

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M58CR032C, M58CR032D
12/63
BUS OPERATIONS
There are two types of bus operations that control
the device: Asynchronous (Read, Page Read,
Write, Output Disable, Standby, Automatic Stand-
by and Reset/Power-Down) and Synchronous
(Synchronous Read
and Synchronous Burst
Read).
The Dual Bank architecture of the M58CR032 al-
lows read/write operations in Bank A, while read
operations are being executed in Bank B or vice
versa. Write operations are only allowed in one
bank at a time (see Table 7).
See Table 3, Bus Operations, for a summary. Typ-
ically glitches of less than 5ns on Chip Enable or
Write Enable are ignored by the memory and do
not affect bus operations.
Asynchronous Read. Asynchronous Read oper-
ations read from the Memory Array, or specific
registers (Electronic Signature, Status Register,
CFI, Block Protection Status, Read Configuration
Register status and Protection Register) in the
Command Interface.
A valid Asynchronous Bus Read operation in-
volves setting the desired address on the Address
Inputs, applying a Low signal, VIL, to Chip Enable
and Output Enable and keeping Write Enable
High, VIH. The address is latched on the rising
edge of the Latch, L, input. The Data Inputs/Out-
puts will output the value, see Figure 11, Asyn-
chronous Read AC Waveforms, and Table 21,
Asynchronous Read AC Characteristics, for de-
tails of when the output becomes valid.
According to the device configuration the following
Read operations: Electronic Signature, Status
Register, CFI, Block Protection Status, Burst Con-
figuration Register Status and Protection Register
must be accessed as asynchronous read or as
single synchronous read.
Asynchronous Page Read. Asynchronous
Page Read operations can be used to read the
content of the memory array, where data is inter-
nally read and stored in a page buffer. The page
has a size of 4 words and is addressed by A0 and
A1 address inputs.
Valid bus operations are the same as Asynchro-
nous Bus Read operations but with different tim-
ings. The first read operation within the page has
identical timings, subsequent reads within the
same page have much shorter access times. If the
page changes then the normal, longer timings ap-
ply again. See Figure 12, Asynchronous Page
Read AC Waveforms and Table 21, Asynchro-
nous Read AC Characteristics for details on when
the outputs become valid.
Asynchronous Page Read is the default state of
the device when exiting power-down or after pow-
er-up.
Asynchronous Write. Bus Write operations are
used to write to the Command Interface of the
memory or latch Input Data to be programmed. A
valid Bus Write operation begins by setting the de-
sired address on the Address Inputs and setting
Chip Enable, E, and Write Enable, W, to VIL and
Output Enable to VIH. Addresses are latched on
the rising edge of L, W or E whichever occur first.
Commands and Input Data are latched on the ris-
ing edge of W or E whichever occurs first. Output
Enable must remain High, VIH, during the whole
Bus Write operation. See Figures 14 and 15, Write
AC Waveforms, and Tables 23 and 24, Write AC
Characteristics, for details of the timing require-
ments.
Write operations are asynchronous and the clock
is ignored during write.
Output Disable. The data outputs are high im-
pedance when the Output Enable, G, and Write
Enable, W, are High, VIH.
Standby. When Chip Enable is High, VIH, and the
Program/Erase Controller is idle, the memory en-
ters Standby mode and the Data Inputs/Outputs
pins are placed in the high impedance state, inde-
pendent of Output Enable, G, or Write Enable, W.
For the Standby current level see Table 19, DC
Characteristics.
Reset/Power-Down. The memory is in Power-
Down when the Burst Configuration Register is set
for Power-Down and RP is at VIL. The power con-
sumption is reduced to the Power-Down level, and
Outputs are in high impedance, independent of
Chip Enable E, Output Enable G or Write Enable
W. The memory is in reset mode when the Burst
Configuration Register is set for Reset and RP is
at VIL. The power consumption is the same of the
standby and the outputs are in high impedance.
After a Reset/Power-Down the device defaults to
Asynchronous Page Read, the Status Register is
cleared and the Burst configuration register de-
faults to Asynchronous Page read.
Automatic Standby. If CMOS levels (VDD ±
0.2V) are used to drive the bus and the bus is in-
active for 150ns or more in Read mode, the mem-
ory enters Automatic Standby where the internal
Supply Current is reduced to the Standby Supply
Current, IDD2. The Data Inputs/Outputs will still
output data if a Bus Read operation is in progress.
The automatic standby feature is not available
when the device is configured for synchronous
burst mode.
Synchronous Single Read. Synchronous
sin-
gle Reads can be used to read the Electronic Sig-
nature, Status Register, CFI, Block Protection
Status, Burst Configuration Register Status or



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