AD9246

Rev. A | Page 8 of 44

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

ELECTRICAL

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to DGND

−0.3 V to +3.9 V

AGND to DGND

−0.3 V to +0.3 V

AVDD to DRVDD

−3.9 V to +2.0 V

D0 through D13 to DGND

−0.3 V to DRVDD + 0.3 V

DCO to DGND

−0.3 V to DRVDD + 0.3 V

OR to DGND

−0.3 V to DRVDD + 0.3 V

CLK+ to AGND

−0.3 V to +3.9 V

CLK− to AGND

−0.3 V to +3.9 V

VIN+ to AGND

−0.3 V to AVDD + 0.2 V

VIN− to AGND

−0.3 V to AVDD + 0.2 V

VREF to AGND

−0.3 V to AVDD + 0.2 V

SENSE to AGND

−0.3 V to AVDD + 0.2 V

REFT to AGND

−0.3 V to AVDD + 0.2 V

REFB to AGND

−0.3 V to AVDD + 0.2 V

SDIO/DCS to DGND

−0.3 V to DRVDD + 0.3 V

PDWN to AGND

−0.3 V to +3.9 V

CSB to AGND

−0.3 V to +3.9 V

SCLK/DFS to AGND

−0.3 V to +3.9 V

OEB to AGND

−0.3 V to +3.9 V

ENVIRONMENTAL

Storage Temperature Range

–65°C to +125°C

Operating Temperature Range

–40°C to +85°C

Lead Temperature

(Soldering 10 Sec)

+300°C

Junction Temperature

+150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

The exposed paddle must be soldered to the ground plane for

the LFCSP_VQ package. Soldering the exposed paddle to the

customer board increases the reliability of the solder joints,

maximizing the thermal capability of the package.

Table 6. Thermal Resistance

Package Type

Unit

48-lead LFCSP_VQ (CP-48-3)

26.4

2.4

°C/W

addition, metal in direct contact with the package leads from

metal traces, and through holes, ground, and power planes,

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.