TGA4548-SM

17 – 20 GHz 10 W GaN Power Amplifier

Data Sheet Rev. C, April 24, 2017 | Subject to change without notice

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Package Marking and Dimensions

Marking: Part Number – TGA4548X-SM

Vendor and Lot Code – MXXXXXXX; “M” is the vendor code, XXXXXXX represents assembly lot number.

Notes:

This package is lead-free/RoHS-compliant with an embedded heat spreader, and the plating material on the leads is NiAu. It is compatible

with both lead-free (maximum 260 °C reflow temperature) and tin-lead (maximum 245 °C reflow temperature) soldering processes.

PCB Mounting Pattern

Notes:

1.

All dimensions are in millimeters. Angles are in degrees.

2.

Ground vias are critical for the proper performance of this device. Vias should have a final plated thru diameter of .1524 mm (.006”).

3.

For best thermal performance, vias under the ground paddle should be copper filled.

4.

The pad pattern shown has been developed and tested for optimized assembly at Qorvo. The PCB land pattern has been developed to

accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is

recommended.