| 数据搜索系统,热门电子元器件搜索 |
|
VS6552V02C/T2 数据表(PDF) 23 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
VS6552V02C/T2 数据表(HTML) 23 Page - STMicroelectronics |
|
23 / 26 page ![]() 23/26 VS6552 8 APPLICATION INFORMATION 8.1 Socket ST has developed a low-profile socket for the SmOP 1.5 package, which is suitable for reflow soldering and manual / automatic insertion of the camera module. The socket has been designed to withstand mobile phone grade reliability tests (temperature, shocks, vibration, salt mist). Please contact ST for details on ST P/N XS0015. See Figure 16 for recommended PCB layout and mechanical footprint of the XS0015 socket. 8.2 EMC and Shielding The VS6552 is a low noise device and is highly tol- erant of high levels of radio frequency (RF) radia- tion. However if this device is closely mounted to a sensitive receiver it is recommended that the VS6552 is shielded to prevent reducing the sensi- tivity or channel masking of the receiver. Recommended maximum field strength: 1kV/m. Maximum radiated power transferred from the VS6552 into a GSM monopole antenna mounted 15 mm away from the VS6552 has peaks of inter- ference at around -90 dBm. This is dependent on system design and layout. To minimized the coupling between the GSM an- tenna and the sensor the following guide lines should be observed. Camera should be positioned as far away from the GSM antenna as possible. The distance between the low frequency (below 1GHz) resonant antenna elements and the camera should also be maxi- mized. The VS6552 and its associated decoupling capac- itors should NOT be connected together using the antenna reference ground. The ground connec- tions in the sub circuit should be connected either: ■ by a dedicated ground trace network, that is connected by a single point to the main ground of the system ■ by an internal ground plane, which is entirely covered and single point connected to a protective ground. The PCLKP and PCLKN lines can be filtered to re- duce the induced noise. The protective ground should be flooded around the sensor socket pads to reduce the radiation ap- erture in the protective ground plane. |
|
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |