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ATSAMB11XR 数据表(PDF) 4 Page - Microchip Technology

部件名 ATSAMB11XR
功能描述  Ultra Low Power BLE 4.1 SiP/Module
PDF  87 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

ATSAMB11XR 数据表(HTML) 4 Page - Microchip Technology

  ATSAMB11XR Datasheet HTML 1Page - Microchip Technology ATSAMB11XR Datasheet HTML 2Page - Microchip Technology ATSAMB11XR Datasheet HTML 3Page - Microchip Technology ATSAMB11XR Datasheet HTML 4Page - Microchip Technology ATSAMB11XR Datasheet HTML 5Page - Microchip Technology ATSAMB11XR Datasheet HTML 6Page - Microchip Technology ATSAMB11XR Datasheet HTML 7Page - Microchip Technology ATSAMB11XR Datasheet HTML 8Page - Microchip Technology ATSAMB11XR Datasheet HTML 9Page - Microchip Technology Next Button
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10.1. Absolute Maximum Ratings........................................................................................................45
10.2. Recommended Operating Conditions........................................................................................ 45
10.3. DC Characteristics..................................................................................................................... 45
10.4. Receiver Performance................................................................................................................46
10.5. Transmitter Performance............................................................................................................47
10.6. Current Consumption in Various Device States......................................................................... 48
10.7. ADC Characteristics................................................................................................................... 49
10.8. ADC Typical Characteristics.......................................................................................................50
10.9. Timing Characteristics................................................................................................................53
11. Package Outline Drawings...................................................................................... 59
11.1. Package Outline Drawing...........................................................................................................59
11.2. Module PCB Package Outline Drawing......................................................................................61
12. Module Reference Schematics................................................................................63
12.1. Reference Schematic................................................................................................................. 63
12.2. Reference Schematic Bill of Materials (BOM)............................................................................ 64
12.3. Reference Schematic................................................................................................................. 65
12.4. Reference Bill of Materials(BOM)...............................................................................................66
13. ATSAMB11-XR2100A Design Considerations.........................................................67
13.1. Layout Recommendation........................................................................................................... 67
13.2. SWD Interface............................................................................................................................ 68
13.3. Unused or Unconnected Pins.....................................................................................................70
14. ATSAMB11-ZR210CA Design Considerations........................................................ 71
14.1. Placement and Routing Guidelines............................................................................................ 71
14.2. Interferers................................................................................................................................... 73
15. Reflow Profile Information....................................................................................... 74
15.1. Storage Condition.......................................................................................................................74
15.2. Stencil Design............................................................................................................................ 74
15.3. Soldering and Reflow Conditions............................................................................................... 74
15.4. Baking Conditions...................................................................................................................... 74
15.5. Module Assembly Considerations.............................................................................................. 75
16. Regulatory Approval................................................................................................ 76
16.1. United States..............................................................................................................................76
16.2. Canada.......................................................................................................................................77
16.3. Europe........................................................................................................................................79
16.4. Other Regulatory Information..................................................................................................... 80
17. Reference Documents and Support........................................................................ 81
17.1. Reference Documents................................................................................................................81
18. Document Revision History..................................................................................... 82
The Microchip Web Site................................................................................................ 83
ATSAMB11XR/ZR
© 2017 Microchip Technology Inc.
Datasheet Preliminary
DS70005342A-page 4



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