PC755CVGU366LE datasheet(38/50 Pages) ATMEL

38 / 50 page

PC755/745

2138D–HIREL–06/03

Figure 25. Mechanical Dimensions and Bottom Surface Nomenclature of the PC745 PBGA

Parameters for the PC755

PBGA

Package Parameter for the

PC755 PBGA

The package parameters are as provided in the following list. The package type is 25 x

25 mm, 360-lead plastic ball grid array (PBGA).

Package outline

25 x 25 mm

Interconnects

360 (19 x 19 ball array – 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.22 mm

Maximum module height

2.77 mm

Ball diameter

0.75 mm (29.5 mil)

Table 1

Millimeters

DIM

Min

Max

2.25

2.80

0.50

0.70

1.00

1.20

0.60

0.90

21.00 BSC

1.27 BSC

0.2

A1 CORNER

0.2

0.15 C

255X

123456789 10 111213141516

0.3

0.15

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

4. CAPACITOR PADS MAY BE UNPOPULATED.

PC755CVGU366LE 数据表(PDF) 38 Page - ATMEL Corporation

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