Data Sheet

HMC6832

Rev. C | Page 23 of 23

OUTLINE DIMENSIONS

0.50

BSC

0.65

0.55

0.45

COMPLIANT

TO JEDEC STANDARDS MO-220-VHHD-1.

BOTTOM VIEW

TOP VIEW

SIDE VIEW

5.10

5.00 SQ

4.90

0.90

0.85

0.80

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

1

28

8

14

15

21

22

7

0.30

0.25

0.18

0.20 MIN

3.25

3.15 SQ

3.05

EXPOSED

PAD

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 56. 28-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.85 mm Package Height

(HCP-28-1)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

HMC6832ALP5LE

−40°C to +85°C

MSL3

28-Lead Lead Frame Chip Scale Package [LFCSP]

HCP-28-1

HMC6832ALP5LETR

−40°C to +85°C

MSL3

28-Lead Lead Frame Chip Scale Package [LFCSP]

HCP-28-1

EV1HMC6832ALP5L

Evaluation Board (LVPECL Configuration)

EV2HMC6832ALP5L

Evaluation Board (LVDS Configuration)

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D13201-0-1/18(C)