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MP6404 数据表(PDF) 9 Page - Toshiba Semiconductor |
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MP6404 数据表(HTML) 9 Page - Toshiba Semiconductor |
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9 / 11 page ![]() MP6404 2004-07-01 9 Ambient temperature Ta (°C) PDT – Ta Total power dissipation PDT (W) ∆Tch – PDT (1) (2) (3) (4) 2 4 6 8 0 160 40 80 120 10 0 Attached on a circuit board (1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 6-device operation Circuit board (4) (3) (2) (1) 0 8 40 2 4 6 80 120 160 200 0 (1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 6-device operation Attached on a circuit board Circuit board 0.001 0.01 0.1 1 10 100 1000 0.1 Curves should be applied in thermal limited area. (Single nonrepetitive pulse) The figure shows thermal resistance per device versus pulse width. -No heat sink/Attached on a circuit board- (1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 6-device operation Circuit board (1) (2) (3) (4) Nch MOS FET Pch MOS FET 0.3 1 3 10 30 100 300 rth – tw Pulse width tw (s) |
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