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MP6404 数据表(PDF) 2 Page - Toshiba Semiconductor |
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MP6404 数据表(HTML) 2 Page - Toshiba Semiconductor |
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2 / 11 page ![]() MP6404 2004-07-01 2 Array Configuration Thermal Characteristics Characteristics Symbol Max Unit Thermal resistance of channel to ambient (6-device operation, Ta = 25°C) ΣRth (ch-a) 28.4 °C/W Thermal resistance of channel to case (6-device operation, Tc = 25°C) ΣRth (ch-c) 3.47 °C/W Maximum lead temperature for soldering purposes (3.2 mm from case for t = 10 s) TL 260 °C 5 12 11 6 4 7 10 8 2 3 1 9 |
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