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ADPA7002CHIP 数据表(PDF) 5 Page - Analog Devices |
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ADPA7002CHIP 数据表(HTML) 5 Page - Analog Devices |
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5 / 23 page ![]() Data Sheet ADPA7002CHIP Rev. 0 | Page 5 of 23 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. Mnemonic Description 1 RFIN Radio Frequency (RF) Signal Input. This pad is ac-coupled and matched to 50 Ω. 2 to 9, 14, 16, 19, 21 NIC No Internal Connection. These pads have no internal connections. 10 VREF Reference Diode for Temperature Compensation of VDET RF Output Power Measurements. 11, 22, Die Bottom GND Ground. These pads and the die bottom must be connected to RF and dc ground. 12 RFOUT RF Signal Output. This pad is ac-coupled and matched to 50 Ω. 13 VDET Detector Diode to Measure RF Output Power. Output power detection via this pin requires the application of a dc bias voltage through an external series resistor. Used in combination with the VREF pin, the difference voltage (VREF − VDET) is a temperature compensated dc voltage that is proportional to the RF output power. 15, 17, 18 VDD1, VDD2A, VDD2B Drain Biases for Amplifier. External bypass capacitors of 4.7 μF and 0.01 μF are required. 20 VGG1 Gate Control for Amplifier. External bypass capacitors of 4.7 μF and 0.01 μF are required. GND RFIN NOTES 1. NIC = NO INTERNAL CONNECTION. THESE PADS HAVE NO INTERNAL CONNECTION. RFOUT GND ADPA7002CHIP TOP VIEW (CIRCUIT SIDE) |
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