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ADPA7002CHIP 数据表(PDF) 20 Page - Analog Devices |
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ADPA7002CHIP 数据表(HTML) 20 Page - Analog Devices |
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20 / 23 page ![]() ADPA7002CHIP Data Sheet Rev. 0 | Page 20 of 23 HMC980LP4E Bias Sequence Proper dc supply sequencing is required to prevent damage to HMC980LP4E. Adhere to the following power-up sequence steps: 1. Set VDIG, the voltage supply input (Pin 9) for the HMC980LP4E digital circuit (see Figure 60) to 3.3 V. 2. Set S0, the digital control pin (Pin 3) that sets the internal field effect transistor (FET) and the internal HMC980LP4E resistor (RDS) resistance (see Figure 60) to 3.3 V. 3. Set the VDD pin to 5.68 V. 4. Set VNEG to −1.5 V. This step is not needed if using internally generated voltage. 5. Set the EN pad to 3.3 V. Transitioning from 0 V to 3.3 V turns on the VGATE and VDRAIN pads. Adhere to the following power-down sequence steps: 1. Set the EN pad to 0 V. Transitioning from 3.3 V to 0 V turns off the VDRAIN and VGATE pads. 2. Set VNEG to 0 V. This step is not required if using internally generated voltage. 3. Set the VDD pin to 0 V. 4. Set S0 to 0 V. 5. Set VDIG to 0 V. When the HMC980LP4E bias control circuit has been set up, the ADPA7002CHIP bias can be toggled on and off by applying 3.3 V or 0 V to the EN pad. If EN is set to +3.3 V, VGATE drops to −1.5 V and VDRAIN is turned on at +5 V. VGATE rises in voltage until IDRAIN equals 800 mA. The closed control loop then regulates IDRAIN at 800 mA. When the EN pad equals 0 V, VGATE is automatically set to −1.5 V and VDRAIN is set to 0 V (see Figure 61 and Figure 62). Figure 61. Turn On—HMC980LP4E Outputs to the ADPA7002CHIP Figure 62. Turn Off—HMC980LP4E Outputs to the ADPA7002CHIP Constant Drain Current Biasing vs. Constant Gate Voltage Biasing The HMC980LP4E uses closed loop feedback to continuously adjust VGATE to maintain a constant gate current bias over dc supply variation, temperature and part to part variation. Constant drain current bias is an excellent method for reducing time in calibration procedures and to maintain consistent performance over time. In comparison to a constant gate voltage bias, where the current increases when RF power is applied, a constant drain current has a slightly lower output P1dB. This effect can be seen in Figure 64 and Figure 66, where RF performance is slightly lower than constant gate voltage bias operation. RF performance is lower due to a lower drain current at high input power levels as the HMC980LP4E reaches 1 dB compression. The output P1dB performance for the constant drain current bias improves if the constant gate voltage bias is increased. By increasing the set current towards IDD, the output P1dB increases up to the RF drive in the constant gate voltage bias condition shown in Figure 64. The current and temperature limit of IDD under the constant current operation is usually set by the thermal limitations found in the table from the Absolute Maximum Ratings section along with the maximum power dissipation specification. Increasing the IDD does not indefinitely increase the actual output P1dB and the power dissipation increases. Therefore, consider the trade- off between power dissipation and output P1dB performance when using constant drain current biasing. CH1 2.00V CH2 1.00V CH3 2.00V CH4 2.00V M20.0ms A CH1 1.12V 3 1 VDD VDRAIN EN VGATE CH1 2.00V CH2 1.00V CH3 2.00V CH4 2.00V M20.0ms A CH1 1.12V 3 1 VDD VDRAIN EN VGATE |
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