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ADPA7002CHIP 数据表(PDF) 23 Page - Analog Devices |
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ADPA7002CHIP 数据表(HTML) 23 Page - Analog Devices |
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23 / 23 page ![]() Data Sheet ADPA7002CHIP Rev. 0 | Page 23 of 23 OUTLINE DIMENSIONS Figure 69. 22-Pad Bare Die [CHIP] (C-22-3) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option ADPA7002CHIP −55°C to +85°C 22-Pad Bare Die [CHIP] C-22-3 ADPA7002C-KIT −55°C to +85°C 22-Pad Bare Die [CHIP] C-22-3 1 The ADPA7002C-KIT is a sample order of two devices. 0.080 1 3 5 8 17 20 4 6 7 10 11 12 14 15 18 19 22 21 9 16 2 13 * This die utilizes fragile air bridges. Any pickup tools used m ust not contact this area. TOP VIEW (CIRCU IT SIDE) 0.100 SIDE VIEW 2.750 1.805 *AIR BR IDGE AR EA 0.578 0.782 0.204 0.578 0.782 0.204 0.010 0.200 0.010 0.110 0.120 0.080 0.432 0.458 0.302 0.459 0.319 0.111 0.219 0.112 0.178 0.095 × 0.195 (Pads 2 and 13) 0.145 × 0.094 (Pads 9 and 16) 0.095 × 0.095 (Pads 1, 4, 6-7,10-12, 14-15, 18-19 and 21) 0.075 × 0.075 (Pads 3, 5, 8, 17, 20 and 22) ©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D17236-0-2/19(0) |
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