9

TUSB8043A

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SLLSF94 – JUNE 2019

Product Folder Links: TUSB8043A

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Copyright © 2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage

Range

-0.3

1.4

V

-0.3

3.8

V

Voltager Range

USB_SSRXP_UP, USB_SSRXN_UP, SSRXP_DN[4:1],

USB_RXN_DP[4:1] and USB_VBUS terminals

-0.3

1,4

V

XI terminal

-0.3

2.45

V

All other terminals

-0.3

3.8

V

Storage temperature

-65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per

±2000

V

Charged device model (CDM), per JEDEC

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

1.1V Supply voltage

0.99

1.1

1.26

V

3.3V Supply voltage

3.0

3.3

3.6

V

USB_VBU

S

Voltage at USB_VBUS terminal.

0

1.155

V

TUSB8043A Ambient temperature

0

70

°C

TUSB8043AI Ambient temperature

-40

85

°C

Junction temperature

-40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TUSB8043A

UNIT

RGC

64 PINS

Junction-to-ambient thermal resistance

26

°C/W

Junction-to-case (top) thermal resistance

11.5

°C/W

Junction-to-board thermal resistance

5.3

°C/W

Junction-to-top characterization parameter

0.2

°C/W

Junction-to-board characterization parameter

5.2

°C/W

Junction-to-case (bottom) thermal resistance

1.0

°C/W