5

TPS7A02

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SBVS277B – JULY 2019 – REVISED MARCH 2020

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Copyright © 2019–2020, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage

–0.3

6.5

V

–0.3

6.5

–0.3

(2)

Current

Maximum output

Internally limited

A

Temperature

–40

150

°C

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±1000

V

±500

(1)

Effective output capacitance of 0.5 µF minimum required for stability.

(2)

22 µF is the maximum derated capacitance that can be used for stability.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

1.5

6.0

V

Enable voltage

0

6.0

V

Output voltage

0.8

5.0

V

Output current

0

200

mA

Input capacitor

1

µF

1

1

22

µF

EN toggle frequency

10

kHz

Operating junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TPS7A02

UNIT

DQN (X2SON)

DBV (SOT-23-5)

YCH (DSBGA)

4 PINS

5 PINS

4 PINS

Junction-to-ambient thermal resistance

179.1

181.9

TBD

°C/W

Junction-to-case(top) thermal resistance

137.6

53.0

TBD

°C/W

Junction-to-board thermal resistance

116.3

88.1

TBD

°C/W

Junction-to-top characterization parameter

6.1

27.1

TBD

°C/W

Junction-to-board characterization parameter

116.3

52.7

TBD

°C/W

Junction-to-case(bottom) thermal resistance

112.3

N/A

TBD

°C/W