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TPS7A02

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SBVS277B – JULY 2019 – REVISED MARCH 2020

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Feature Description (continued)

The thermal time-constant of the semiconductor die is fairly short, thus the device may cycle on and off when

thermal shutdown is reached until power dissipation is reduced. Power dissipation during startup can be high

capacitors. Under some conditions, the thermal shutdown protection disables the device before startup

completes.

For reliable operation, limit the junction temperature to the maximum listed in the Recommended Operating

Conditions table. Operation above this maximum temperature causes the device to exceed its operational

specifications. Although the internal protection circuitry of the device is designed to protect against thermal

overall conditions, this circuitry is not intended to replace proper heat sinking. Continuously running the device

into thermal shutdown or above the maximum recommended junction temperature reduces long-term reliability.