Data Sheet

ADPA7007

Rev. 0 | Page 5 of 23

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

6.0 V

−1.6 V to 0 V

Radio Frequency Input Power (RFIN)

27 dBm

T = 85°C (Derate 137 mW/°C

Above 85°C)

12.33 W

Storage Temperature Range

−55°C to +150°C

Operating Temperature Range

−40°C to +85°C

Junction Temperature to Maintain

1,000,000 Hour Mean Time to Failure

(MTTF)

175°C

Nominal Junction Temperature

136.1°C

260°C

Moisture Sensitivity Level

MSL3

1

See the Ordering Guide for additional information.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to system design and

operating environment. Careful attention to the printed circuit

board (PCB) thermal design is required.

of die using die attach epoxy.

Table 5. Thermal Resistance

Package Type

Unit

7.3

°C/W

1

transfer is due solely to thermal conduction from the channel, through the

ground pad, to the PCB. The ground pad is held constant at the operating

temperature of 85°C.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of

ESD sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADPA7007

Table 6. ADPA7007, 18-Terminal LCC_HS

ESD Model

Withstand Threshold (V)

Class

HBM

250

1A

ESD CAUTION