ADPA7007

Data Sheet

Rev. 0 | Page 6 of 23

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

1

2

3

4

10

11

12

13

NOTES

1. NIC = NO INTERNAL CONNECTION. NOTE

THAT DATA SHOWN HEREIN WAS

MEASURED WITH THESE PINS EXTERNALLY

CONNECTED TO RF AND DC GROUND.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE

CONNECTED TO RF AND DC GROUND.

ADPA7007

Figure 2. Pin Configuration

Table 7. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 2, 3, 11, 12, 13

Drain Bias for the Amplifier.

4, 10

Amplifier Gate Control. ESD protection diodes are included and turn on below −1.5 V.

5, 9

NIC

Not Internally Connected. Note that data shown herein was measured with these pins externally

connected to RF and dc ground.

6, 8, 15, 17

GND

Ground Pins. Connect the GND pins and the exposed pad to RF and dc ground.

7

RFIN

RF Signal Input. This pin is ac-coupled and internally matched to 50 Ω.

14

VDET

Detector Diode Used for Measuring the RF Output Power. Detection via VDET requires the application

of a dc bias voltage through an external series resistor. Used in combination with VREF, the difference

voltage, VREF − VDET, is a temperature compensated dc voltage proportional to the RF output power.

16

RFOUT

RF Signal Output. RFOUT is ac-coupled and internally matched to 50 Ω.

18

VREF

Reference Diode Used for Temperature Compensation of VDET RF Output Power Measurements.

Detection via VERF requires the application of a dc bias voltage through an external series resistor.

Used in combination with VDET, this voltage provides temperature compensation to VDET RF output

power measurements.

EPAD

Exposed Pad. The exposed pad must be connected to RF and dc ground.