Data Sheet

ADPA7007

Rev. 0 | Page 23 of 23

OUTLINE DIMENSIONS

TOP VIEW

BOTTOM VIEW

SIDE VIEW

7.20

7.00 SQ

6.80

PIN 1

INDICATOR

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

4.55 BSC

SQ

5.40 SQ

1

4

5

9

10

13

14

18

1.00 BSC

3.10

3.00

2.90

4.50

4.40

4.30

3.55

3.45

3.35

1.75

1.65

1.55

0.31

0.25

0.19

0.60

0.50

0.40

1.21

1.15

1.09

0.63

0.57

0.51

0.80 REF

0.35 REF

0.89

1.05

1.444

1.317

1.190

Figure 64. 18-Terminal Ceramic Leadless Chip Carrier with Heat Sink [LCC_HS]

(EH-18-1)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Range

MSL

Package Description

Package

Option

ADPA7007AEHZ

−40°C to +85°C

MSL3

18-Terminal Ceramic Leadless Chip Carrier with Heat Sink [LCC_HS]

EH-18-1

ADPA7007AEHZ-R7

−40°C to +85°C

MSL3

18-Terminal Ceramic Leadless Chip Carrier with Heat Sink [LCC_HS]

EH-18-1

ADPA7007-EVALZ

1

Z = RoHS Compliant Part.

2

See the Absolute Maximum Ratings section for additional information.

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registered trademarks are the property of their respective owners.

D21544-7/20(0)