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PCF8553DTT/A 数据表(PDF) 39 Page - NXP Semiconductors |
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PCF8553DTT/A 数据表(HTML) 39 Page - NXP Semiconductors |
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39 / 51 page ![]() NXP Semiconductors PCF8553 40 × 4 LCD segment driver 16 Package outline UNIT A1 A2 A3 bp c D(1) E(2) e HE L Lp Q Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.2 0.1 8 0 o o 0.1 DIMENSIONS (mm are the original dimensions). Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. SOT364-1 99-12-27 03-02-19 w M θ A A1 A2 D Lp Q detail X E Z e c L X (A ) 3 0.25 1 28 56 29 y pin 1 index b H 1.05 0.85 0.28 0.17 0.2 0.1 14.1 13.9 6.2 6.0 0.5 1 8.3 7.9 0.50 0.35 0.5 0.1 0.08 0.25 0.8 0.4 p E v M A A TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 A max. 1.2 0 2.5 5 mm scale MO-153 Figure 28. Package outline SOT364-1 (TSSOP56) of PCF8553DTT PCF8553 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 4 — 20 April 2021 39 / 51 |
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