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ADUCM3029BCBZ-R7 数据表(PDF) 38 Page - Analog Devices |
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ADUCM3029BCBZ-R7 数据表(HTML) 38 Page - Analog Devices |
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38 / 39 page ![]() ADuCM3027/ADuCM3029 Data Sheet Rev. B | Page 38 of 39 OUTLINE DIMENSIONS 0.50 BSC 4.60 4.50 SQ 4.40 0.50 0.40 0.30 0.80 0.75 0.70 0.05 MAX 0.02 NOM 0.203 REF COPLANARITY 0.08 0.30 0.25 0.20 9.10 9.00 SQ 8.90 0.20 MIN 7.50 REF COMPLIANT TO JEDEC STANDARDS MO-220-WMMD 1 64 16 17 49 48 32 33 BOTTOM VIEW TOP VIEW END VIEW SEATING PLANE EXPOSED PAD DETAIL A (JEDEC 95) P IN 1 IN D IC AT O R AR E A OP T IO N S (SEE DETAIL A) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. PIN 1 INDICATOR AREA Figure 29. 64-Lead Frame Chip Scale Package [LFCSP] 9 mm × 9 mm Body and 0.75 mm Package Height (CP-64-16) Dimensions shown in millimeters 0.530 0.470 0.410 2.800 2.760 SQ 2.720 0.210 0.180 0.150 0.320 0.290 0.260 0.280 0.240 0.200 BALL A1 IDENTIFIER COPLANARITY 0.05 SEATING PLANE 0.303 BSC 0.35 BSC 0.108 0.210 0.350 BSC BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) END VIEW 0.103 A B C D E F G H 1 2 3 4 5 6 7 8 9 10 11 12 13 Figure 30. 54-Ball Wafer Level Chip Scale Package [WLCSP] (CB-54-1) Dimensions shown in millimeters |
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