ADUCM3029BCBZ-R7 datasheet(15/39 Pages) AD

15 / 39 page

Data Sheet

ADuCM3027/ADuCM3029

Rev. B | Page 15 of 39

ABSOLUTE MAXIMUM RATINGS

Table 18.

Parameter

Rating

Supply

VBAT_ANA1, VBAT_ANA2, VBAT_ADC,

VBAT_DIG1, VBAT_DIG2, and

VREF_ADC

−0.3 V to +3.6 V

Analog

VDCDC_CAP1N, VDCDC_CAP1P,

VDCDC_OUT, VDCDC_CAP2N, and

VDCDC_CAP2P

−0.3 V to +3.6 V

VLDO_OUT, SYS_HFXTAL_IN, SYS_

HFXTAL_OUT, SYS_LFXTAL_IN, and

SYS_LFXTAL_OUT

−0.3 V to +1.32 V

Digital Input/Output

P0_xx, P1_xx, P2_xx, and SYS_HWRST

−0.3 V to +3.6 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required. θJA can be used for a first-order

approximation of TJ by the following equation:

TJ = TA + (θJA × PD)

where:

TJ is junction temperature (°C).

TA is ambient temperature (°C).

PD is power dissipation (to calculate power dissipation).

Table 19. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-64-16

26.3

1.0

°C/W

ESD CAUTION

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