Data Sheet

ADP8140

Rev. B | Page 23 of 23

OUTLINE DIMENSIONS

Figure 37. 16-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-16-29)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADP8140ACPZ-1-R7

350

−40°C to +125°C

16-Lead LFCSP, 7”Tape and Reel

CP-16-29

ADP8140ACPZ-2-R7

450

−40°C to +125°C

16-Lead LFCSP, 7”Tape and Reel

CP-16-29

ADP8140EB-EVALZ

ADP8140 PMOS Evaluation Board

ADP8140CP-EVALZ

ADP8140EB-EVALZ with the LEDs and Heat Sink

3.40

3.30

3.20

2.80

2.70

2.60

COMPLIANT

TO JEDEC STANDARDS MO-229-WGGE.

1

0.40 BSC

8

9

16

4.10

4.00 SQ

3.90

0.50

0.40

0.30

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

0.25

0.20

0.15

PIN 1 INDEX

AREA

TOP VIEW

BOTTOM VIE W

0.20 MIN

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

SIDE VIEW

EXPOSED

PAD

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registered trademarks are the property of their respective owners.

D10935-9/20(B)