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Data Sheet

AD9986

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 17 of 37

Table 18.

Parameter

Rating

ISET, DACxP, DACxN, TDP, TDN

−0.3 V to AVDD2 + 0.3 V

VCO_COARSE, VCO_FINE, VCO_VCM,

VCO_VREG

−0.3 V to AVDD2_PLL + 0.3 V

Receiver Input Power (ADC0P/N,

ADC1P/N)1

22 dBm

VCM0, VCM1

−0.3 V to RVDD2 + 0.3 V

CLKINP, CLKINN

−0.2 V to PLLCLKVDD1 + 0.2 V

ADCDRVN, ADCDRVP

−0.2 V to CLKVDD1 + 0.2 V

SERDINx±, SERDOUTx±

−0.2 V to SVDD1 + 0.2 V

SYSREFP, SYSREFN, and SYNCxINB±

−0.2 V to +2.5 V

SYNCxOUTB±, RESETB, TXENx, RXENx,

IRQB_x, CSB, SCLK, SDIO, SDO,

TMU_REFN, TMU_REFP, ADCx_SMON0,

ADCx_SMON1, ADCx_FD0, ADCx_FD1,

GPIOx

−0.3 V to DVDD1P8 + 0.3 V

AVDD2, AVDD2_PLL, BVDD2, RVDD2,

SVDD2_PLL, DVDD1P8

−0.3 V to +2.2 V

PLLCLKVDD1, AVDD1, AVDD1_ADC,

CLKVDD1, FVDD1, DAVDD1, DVDD1_RT,

DCLKVDD1, SVDD1, SVDD1_PLL

−0.2 V to +1.2 V

VNN1

−1.1 V to +0.2 V

Temperature Ranges

Maximum Junction (TJ)2

120°C

Storage

−65°C to +150°C

1 Tested continuously for 1000 hours with fIN = 4.7 GHz pulsed and continuous

tone at maximum allowed junction temperature (TJ). Refer to UG-1578, the

device user guide, for more information.

2 Do not exceed this temperature for any duration of time when the device is

powered.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

REFLOW PROFILE

The AD9986 reflow profile is in accordance with the JEDEC

JESD20 criteria for Pb-free devices. The maximum reflow tempera-

ture is 260°C.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. The use of appropriate

thermal management techniques is recommended to ensure that

the maximum TJ does not exceed the limits shown in Table 18.

θJA is the natural convection, junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure.

θJC_TOP is the junction to case, thermal resistance.

θJB is the junction to board, thermal resistance.

Table 19. Thermal Resistance

PCB Type1

Airflow Velocity (m/

sec)

θJA

θJC_TOP θJB

Unit

JEDEC 2s2p Board 0.0

14.9

0.7

1.8

°C/W

1 Thermal resistance values specified are simulated based on JEDEC specifica-

tions in compliance with JESD51-12 with the device power equal to 9 W.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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