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ADMV8913SCCZ-EP-R2 数据表(PDF) 7 Page - Analog Devices |
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ADMV8913SCCZ-EP-R2 数据表(HTML) 7 Page - Analog Devices |
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7 / 23 page ![]() Enhanced Product ADMV8913-EP Rev. 0 | Page 7 of 23 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 30 1 5 4 3 2 GND GND GND RF1 GND GND NOTES 1. EXPOSED PAD. THE EXPOSED PAD MUST BE CONNECTED TO THE RF AND DC GROUND. GND GND RF2 GND 20 16 17 18 19 29 28 27 26 25 24 23 22 21 6 7 8 9 10 11 12 13 14 15 ADMV8913-EP Figure 3. Pin Configuration Table 5. Pin Function Descriptions Pin No. Mnemonic Description 1, 2, 4, 5, 13, 16, 17, 19, 20 GND Ground. Connect the GND pins to the RF and dc ground. 3 RF1 RF Pin 1. RF1 is dc-coupled and matched to 50 Ω. Do not apply an external voltage to RF1. 6 RST Chip Reset. 3.3 V logic. Active low. The RST pin is internally pulled high with a 260 kΩ resistor. 7 SCLK SPI Clock. 3.3 V logic. The SCLK pin is internally pulled low with a 260 kΩ resistor. 8 CS SPI Chip Select. 3.3 V logic. Active low. The CS pin is internally pulled low with a 260 kΩ resistor. In parallel mode, the CS pin can be toggled high to latch in logic data synchronously or held high for asynchronous logic update. 9 SDI SPI Data Input. 3.3 V logic. The SDI pin is internally pulled low with a 260 kΩ resistor. 10 SDO SPI Data Output. 3.3 V logic. The SDO pin is internally pulled low with a 260 kΩ resistor. 11 SFL SPI Fast Latch Enable. 3.3 V logic. Set SFL high to enable fast latching of filter states on each rising edge of CS. While SFL is in this mode, the SCLK, SDO, and SDI pins are not active. The SFL pin is internally pulled low with a 260 kΩ resistor. 12 VDD1 2.5 V Power Supply Pin. Place 47 µF, 0.1 µF, and 100 pF decoupling capacitors close to VDD1. By default, the 2.5 V voltage is generated by an on-chip LDO regulator. To provide voltage to VDD1 ground the LDO_EN pin to disable the on-chip LDO regulator. Do not apply an external voltage to VDD1 when the LDO regulator is enabled. 14 VDD2 3.3 V Power Supply Pin. Place 0.1 µF and 100 pF decoupling capacitors close to VDD2. 15 VSS1 –2.5 V Power Supply Pin. Place 0.1 µF and 100 pF decoupling capacitors close to VSS1. 18 RF2 RF Pin 2. RF2 is dc-coupled and matched to 50 Ω. Do not apply an external voltage to RF2. 21 LDO_EN LDO Regulator Enable Input. 3.3 V logic. The LDO_EN pin is internally pulled high with a 260 kΩ resistor. Ground LDO_EN to disable the on-chip LDO regulator. Leave LDO_EN floating for logic high to enable the on-chip LDO regulator (recommended configuration). 22 LPF_B0 LPF Bit 0. 3.3 V logic. The LPF_B0 pin is internally pulled low with a 260 kΩ resistor. 23 LPF_B1 LPF Bit 1. 3.3 V logic. The LPF_B1 pin is internally pulled low with a 260 kΩ resistor. 24 LPF_B2 LPF Bit 2. 3.3 V logic. The LPF_B2 pin is internally pulled low with a 260 kΩ resistor. 25 LPF_B3 LPF Bit 3. 3.3 V logic. The LPF_B3 pin is internally pulled low with a 260 kΩ resistor. 26 HPF_B0 HPF Bit 0. 3.3 V logic. The HPF_B0 pin is internally pulled low with a 260 kΩ resistor. |
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