Data Sheet

ADPA1106

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 4 of 19

Table 3.

Parameter

Rating

Bias Voltage

55 V dc

−5 V to 0 V dc

RF Input Power (RFIN)

30 dBm

Maximum Drain Bias

Pulse Width

500 µs

Duty Cycle

20%

Drain Bias Pulse Width = 100 µs at 10% Duty Cycle

85°C

54.5 W

Nominal Pulsed Peak Channel Temperature at 85°C,

158.9°C

Drain Bias Pulse Width = 200 µs at 20% Duty Cycle

Above 85°C

40.8 W

Nominal Pulsed Peak Channel Temperature at 85°C,

184.5°C

Maximum Channel Temperature

200°C

Storage Temperature Range

−60°C to +125°C

Operating Temperature Range

−40°C to +85°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to the

PCB thermal design is required.

tions: the heat transfer is due solely to the thermal conduction from

the channel through the ground pad to the PCB, and the ground

pad is held constant at the operating temperature of 85°C.

Table 4. Thermal Resistance

Package Type

Unit

CG-32-2

Drain Bias Pulse Width = 100 µs1

2.11

°C/W

Drain Bias Pulse Width = 200 µs2

2.82

°C/W

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADPA1106

Table 5. ADPA1106, 32-Lead LFCSP_CAV

ESD Model

Withstand Threshold (V)

Class

HBM

500

1B

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.