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LT8685SRVPBF 数据表(PDF) 2 Page - Analog Devices |
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LT8685SRVPBF 数据表(HTML) 2 Page - Analog Devices |
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2 / 24 page ![]() LT8685S 2 Rev. 0 For more information www.analog.com PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS VIN1, VIN2 ................................................... –0.3V to 42V VIN3, VIN4................................................... –0.3V to 10V EN/UVLO, EN2, EN3, EN4..........................................42V PG1, PG2, PG3, PG4, SYNC/MODE.............................6V BIAS........................................................... –0.3V to 14V FB1, FB2, FB3, FB4......................................................4V TRK/SS1, TRK/SS2, TRK/SS3, TRK/SS4....................4V Operating Junction Temperature (Notes 2, 3) LT8685SR.......................................... –40°C to 150°C Storage Temperature Range .................. –65°C to 150°C Maximum Reflow (Package Body) Temperature..........................................................260°C (Note 1) VIN1 VIN2 TRK/SS2 SYNC/MODE RT TRK/SS4 VIN3 VIN3 VIN4 VIN4 SW2 BST2 PG2 BIAS INTVCC TRK/SS3 PG3 BST3 SW3 SW3 TOP VIEW LQFN PACKAGE 36-LEAD (5mm × 6mm × 0.95mm) TJMAX = 150°C, θJA = 19°C/W, θJC_top = 18.3°C/W, θJC_bottom = 5.4°C/W EXPOSED PAD (PINS 37 TO 40) MUST BE SOLDERED TO PCB GND NOTE: 1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS; 2) θJA VALUE IS OBTAINED WITH DEMO BOARD. 1 2 3 4 5 6 7 8 9 10 28 27 26 25 24 23 22 21 20 19 13 12 11 14 15 16 17 18 34 35 36 33 32 31 30 29 37 GND 38 GND 39 GND 40 GND ORDER INFORMATION PART NUMBER TAPE AND REEL PAD OR BALL FINISH PART MARKING PACKAGE TYPE* MSL RATING TEMPERATURE RANGE (SEE NOTE 2) DEVICE FINISH CODE LT8685SRV#PBF LT8685SRV#TRPBF Au (RoHS) 8685S e4 LQFN (Laminate Package with QFN Footprint) 3 –40°C to 150°C AUTOMOTIVE PRODUCTS** LT8685SRV#WPBF LT8685SRV#WTRPBF Au (RoHS) 8685S e4 LQFN (Laminate Package with QFN Footprint) 3 –40°C to 150°C • Pad or ball finish code is per IPC/JEDEC J-STD-609. • Tape and reel specifications. • Parts ending with PBF and RoHS are WEEE compliant. • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures • LGA and BGA Package and Tray Drawings *The LT8685S package has the same dimensions as a standard 5mm × 6mm QFN package. **Versions of this part are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. These models are designated with a #W suffix. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models. |
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