P9412 Datasheet

R35DS0011EU0120 Rev.1.2

Jul.6.21

Page 7

2.

Specifications

2.1

Absolute Maximum Ratings

The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause

permanent damage to the device. Functional operation of the P9412 at absolute maximum ratings is not implied.

Exposure to absolute maximum rating conditions may affect device reliability.

Table 2. Absolute Maximum Ratings

Symbol/Pins

Parameter

Conditions

Minimum

Maximum

Unit

TJ

Junction temperature

-

-

150

°C

TS

Storage temperature

-

-55

150

°C

HBM – All Pins except AC1,AC2,Vrect

ESD – Human Body Model

-

-

2000

V

HBM - AC1,AC2,Vrect

ESD – Human Body Model

-

-

1000

V

CDM

ESD – Charged Device Model

-

-

500

V

AC1, AC2, CM1, CM2, CMA, CMB, VRECT, PCLAMP Maximum Voltage

-0.3

26.5

V

LDO1P8, V1P8AP, GPIO0 – GPIO5

Maximum Voltage

-0.3

2

V

DEMOD, LDO5P0, V5P0AP, nEN, GPOD0, SCL

(OD1), SDA (OD2), /INT (OD3), GPOD4-GPOD6,

PLCAMP_Dr, VENSE, TxEN

Maximum Voltage

-0.3

6

V

BST1, BST2

Maximum Voltage

-0.3

AC1+5, AC2+5

V

CPOUT, CPN, CPP, ISP, ISN

Maximum Voltage

-0.3

13

V

CPBST1

Maximum Voltage

-0.3

CPN + 5

V

CPBST2

Maximum Voltage

-0.3

CPOUT + 5

V

CPBST3

Maximum Voltage

-0.3

CPP + 5

V

CPGND, GND, PGND

Maximum Voltage

-0.3

0.3

V

VOUT, VOUT_S

Maximum Voltage

-0.3

21.5

V

CPOUT Output Current

Maximum RMS Current

3.3

A

AC1, AC2

Maximum RMS Current1

2

A

VOUT Output Current

Maximum RMS Current

1.65

A

2.2

Thermal Characteristics 2,3,4,5

Table 3. Thermal Characteristics

Symbol

Parameter

Value

Unit

θ

JA

4

Theta JA. Junction to ambient.

25.5

°C/W

θ

JB

4

Theta JB. Junction to board.

1.5

°C/W

θ

JC

4

Theta JC. Junction to case.

0.08

°C/W

-

Moisture Sensitivity Rating (Per J-STD-020)

MSL 1

-

1.

Rectifier Mosfets are fully turned on.

2.

The maximum power dissipation is PD(MAX) = (TJ(MAX) -

TA) / θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable

power dissipation will result in excessive die temperature, and the device will enter thermal shutdown.

3.

This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3” × 4.5” in still air conditions.

4.

Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other

unlisted variables.

5.

For the WLCSP (AHG81) package, connecting PGND balls and at least TBD# other CSP balls (TBD# thermal balls total) to

internal/external ground planes from top to bottom sides of the PCB is recommended for improving the overall thermal performance.