9.2

UFDFPN8 (DFN8) package information

UFDFPN8 is an 8-lead, 2 × 3 mm, 0.55 mm thickness ultra thin profile fine pitch dual flat package.

Figure 15. UFDFPN8 - Outline

Top view

Pin #1

ID marking

Side view

Seating plane

eee

ccc

C

C

C

C

C

B

A

1 2

N

D

E

aaa

aaa

A

A1

A3

2x

2x

Datum A

Terminal tip

Detail “A”

Even terminal

L1

L3

L

e

e/2

Pin #1

ID marking

Bottom view

See Detail “A”

e

e

1 2

ND-1 x

D2

L1

L3

E2

K

L

b

1.

Maximum package warpage is 0.05 mm.

2.

Exposed copper is not systematic and can appear partially or totally according to the cross section.

3.

Drawing is not to scale.

4.

The central pad (the area E2 by D2 in the above illustration) must be either connected to VSS or left floating

(not connected) in the end application.

M24C16-W M24C16-R M24C16-F

UFDFPN8 (DFN8) package information

DS9194 - Rev 11

page 26/40