M24C16-R datasheet(35/40 Pages) STMICROELECTRONICS

35 / 40 page

Date

Revision

Changes

18-Feb-2015

Removed: WLCSP package reference, tables and figures in all document

Updated: Table 54 and Table 70

01-Jul-2015

Updated: Section 6, Table 70

Added note 1 on Table 70

18-Mar-2016

Updated Features, Figure 41: Read mode sequences, Figure 51: UFDFPN5 – 1.7x1.4

mm, 0.55 mm thickness, ultra thin fine pitch dual flat package, no lead - package outline

and Table 53: UFDFPN5 - 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch dual flat

package, no lead - package mechanical data

02-Oct-2017

Added reference to DFN8 and DFN5 in:

•

cover page figure, Figure 3: UFDFPN5 (DFN5) package connections

•

Section 9.1: UFDFPN5 (DFN5) package information, Section 9.2: UFDFPN8 (DFN8)

package information.

Updated Table 9: AC measurement conditions, Table 23: Ordering information scheme.

Added Figure 14: UFDFPN5 - 5-lead, 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine

pitch dual flat package, no lead recommended footprint

04-Jun-2020

Updated:

•

Section Features

•

Figure 4. Block diagram

•

Table 4. Absolute maximum ratings,

•

title of Table 7. Operating conditions (voltage range F)

•

notes in: Table 10. Cycling performance, Table 11. Memory cell data retention,

Table 12. DC characteristics (M24C16-W, device grade 6)Table 13. DC

characteristics (M24C16-R device grade 6), Table 14. DC characteristics (M24C16-

F device grade 6)

Removed Package PDIP8 in whole document, Table 8. Operating conditions (voltage

range F, for all other devices)

Added specification in Wafer thickness feature of Table 22. Ordering information scheme

(unsawn wafer)

12-Oct-2020

Updated Section Features and Section 1 Description.

Added note in Section 5.1.3 Minimizing write delays by polling on ACK.

Updated Table 21. Ordering information scheme and Table 22. Ordering information

scheme (unsawn wafer).

Updated Figure 1. Logic diagram.

Minor text edits across the whole document.

M24C16-W M24C16-R M24C16-F

DS9194 - Rev 11

page 35/40

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