M24M01-R_V01 datasheet(46/47 Pages) STMICROELECTRONICS

46 / 47 page

Revision history

M24M01-R M24M01-DF

46/47

DocID12943 Rev 14

13-May-2015

Added:

– Unsawn wafer reference on cover page and Table 21: Ordering

information scheme (unsawn wafer)

– Figure 3

– Notes 1 and 2 on Table 5

– title of Table 10

– note 1 on Table 11

–VIL parameter on Table 12 and Table 13

–tNS max value on Table 14 and Table 15

– note 9 on Table 13

– Table 20

Added:

– Notes 9 and 10 on Table 12

– Notes 2and 3 on Table 13

– Figure 19: WLCSP 8-bump wafer-length chip-scale package

recommended land pattern

– Table 21

– Engineering samples reference

Removed:

– note 5 on Min value of tCLQX Table 13

10-June-2015

Updated:

– Note 1 on Figure 2

– Table 20

– note 1 on Table 20

04-Jul-2016

Updated:

– Table 12: DC characteristics (M24M01-R, device grade 6),

Table 13: DC characteristics (M24M01-DF, device grade 6),

Table 18: WLCSP- 8-bump, without BSC, 2.578 x 1.716 mm, wafer

level chip scale package outline, Figure 18: WLCSP- 8-bump,

without BSC, 2.578 x 1.716 mm, wafer level chip scale package

outline, Figure 20: WLCSP- 8-bump, 2.578 x 1.716 mm, wafer level

chip scale package recommended footprint

Added:

– Table 19: WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer

level chip scale package outline, Figure 19: WLCSP- 8-bump, with

BSC, 2.578 x 1.716 mm, wafer level chip scale package outline

23-Oct-2017

Added CX reference in WLCSP package in cover page, Section 9.3:

WLCSP8 ultra thin package information.

Updated title in Figure 3: WLCSP connections (top view, marking

side, with balls on the underside), Table 5: Absolute maximum

ratings, Table 21: Ordering information scheme

Table 23. Document revision history (continued)

Date

Revision

Changes

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