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M24M01-R 数据表(PDF) 40 Page - STMicroelectronics |
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M24M01-R 数据表(HTML) 40 Page - STMicroelectronics |
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40 / 47 page ![]() Package information M24M01-R M24M01-DF 40/47 DocID12943 Rev 14 Figure 21. WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer level chip scale package outline 1. Drawing is not to scale. 2. Primary datum Z and seating plane are defined by the spherical crowns of the bump. Table 20. WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer level chip scale package outline Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.525 0.565 0.605 0.0207 0.0222 0.0238 A1 - 0.190 - - 0.0075 - A2 - 0.350 - - 0.0138 - A3 - 0.025 - - 0.0010 - b(2) - 0.270 - - 0.0106 - D - 2.578 2.598 - 0.1015 0.1023 E - 1.716 1.736 - 0.0676 0.0683 e - 1.000 - - 0.0394 - e1 - 0.866 - - 0.0341 - e2 - 0.500 - - 0.0197 - |
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