M24M01-R_V01 datasheet(36/47 Pages) STMICROELECTRONICS

36 / 47 page

Package information

M24M01-R M24M01-DF

36/47

DocID12943 Rev 14

9.3

WLCSP8 ultra thin package information

Figure 18. WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale

package outline

1. Drawing is not to scale.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.

4. Bump position designation per JESD 95-1, SPP-010.

Table 18. WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale

mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.425

0.465

0.505

0.0167

0.0183

0.0199

0.190

0.0075

0.275

0.0108

0.270

0.0106

2.578

2.598

0.1015

0.1023

1.716

1.736

0.0676

0.0683

1.000

0.0394

0.866

0.0341

0.500

0.0197

0.500

0.0197

0.425

0.0167

M24M01-R 数据表(PDF) 36 Page - STMicroelectronics

M24M01-R 数据表(HTML) 36 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47

数据表下载