M24M01-R_V01 datasheet(32/47 Pages) STMICROELECTRONICS

32 / 47 page

Package information

M24M01-R M24M01-DF

32/47

DocID12943 Rev 14

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

For die information concerning the M24M01 delivered in unsawn wafer, please contact your

nearest ST Sales Office.

9.1

TSSOP8 package information

Figure 15.TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,

package outline

1. Drawing is not to scale.

Table 16. TSSOP8 – 3 x 4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,

package mechanical data

Symbol

millimeters

inches(1)

Min.

Typ.

Max.

Min.

Typ.

Max.

1.200

0.0472

0.050

0.150

0.0020

0.0059

0.800

1.000

1.050

0.0315

0.0394

0.0413

0.190

0.300

0.0075

0.0118

0.090

0.200

0.0035

0.0079

0.100

0.0039

2.900

3.000

3.100

0.1142

0.1181

0.1220

0.650

0.0256

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