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M24M01-R 数据表(PDF) 41 Page - STMicroelectronics |
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M24M01-R 数据表(HTML) 41 Page - STMicroelectronics |
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41 / 47 page ![]() DocID12943 Rev 14 41/47 M24M01-R M24M01-DF Package information 46 Figure 22. WLCSP- 8-bump, 2.578 x 1.716 mm, wafer level chip scale package recommended footprint 1. Dimensions are expressed in millimeters. e3 - 0.500 - - 0.0197 - F - 0.425 - - 0.0167 - G - 0.789 - - 0.0311 - aaa - 0.110 - - 0.0043 - bbb - 0.110 - - 0.0043 - ccc - 0.110 - - 0.0043 - ddd - 0.060 - - 0.0024 - eee - 0.060 - - 0.0024 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 20. WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer level chip scale package outline (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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