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M24M02-R 数据表(PDF) 24 Page - STMicroelectronics

部件名 M24M02-R
功能描述  2-Mbit serial I²C bus EEPROM
PDF  40 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

M24M02-R 数据表(HTML) 24 Page - STMicroelectronics

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Table 14. 1 MHz AC characteristics
Symbol
Alt.
Parameter
Min.
Max.
Unit
fC
fSCL
Clock frequency
0
1
MHz
tCHCL
tHIGH
Clock pulse width high
260
-
ns
tCLCH
tLOW
Clock pulse width low
400
-
ns
tXH1XH2
tR
Input signal rise time
(1)
(1)
ns
tXL1XL2
tF
Input signal fall time
(1)
(1)
ns
tQL1QL2(2)
tF
SDA (out) fall time
20(3)
120
ns
tDXCH
tSU:DAT
Data in setup time
50
-
ns
tCLDX
tHD:DAT
Data in hold time
0
-
ns
tCLQX(4)
tDH
Data out hold time
100
-
ns
tCLQV(5)
tAA
Clock low to next data valid (access time)
-
450
ns
tCHDL
tSU:STA
Start condition setup time
250
-
ns
tDLCL
tHD:STA
Start condition hold time
250
-
ns
tCHDH
tSU:STO
Stop condition setup time
250
-
ns
tDHDL
tBUF
Time between Stop condition and next Start condition
500
-
ns
tWLDL(2)(6)
tSU:WC
WC set up time (before the Start condition)
0
-
µs
tDHWH(2)(7)
tHD:WC
WC hold time (after the Stop condition)
1
-
µs
tW
tWR
Write time
-
10
ms
tNS(2)
-
Pulse width ignored (input filter on SCL and SDA)
-
80
ns
1. There is no min. or max. values for the input signal rise and fall times. It is however recommended by the I²C specification
that the input signal rise and fall times be less than 120 ns when fC < 1 MHz.
2. Evaluated by characterization - Not tested in production.
3. With CL = 10 pF.
4. To avoid spurious start and stop conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of
SDA.
5. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach either 0.3 VCC or 0.7 VCC, assuming
that the Rbus × Cbus time constant is within the values specified in Figure 13.
6. WC=0 set up time condition to enable the execution of a WRITE command.
7. WC=0 hold time condition to enable the execution of a WRITE command.
M24M02-DR M24M02-R
DC and AC parameters
DS7025 - Rev 11
page 24/40



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