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M24M02-R 数据表(PDF) 28 Page - STMicroelectronics

部件名 M24M02-R
功能描述  2-Mbit serial I²C bus EEPROM
PDF  40 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

M24M02-R 数据表(HTML) 28 Page - STMicroelectronics

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9.1
SO8N package information
This SO8N is an 8-lead, 4.9 x 6 mm, plastic small outline, 150 mils body width, package.
Figure 15. SO8N – Outline
E1
8
ccc
b
D
c
1
E
h x 45˚
A2
k
0.25 mm
L
A1
GAUGE PLANE
e
A
L1
C
SEATING
PLANE
Package SO8N (package code O7)
1.
Drawing is not to scale.
Table 15. SO8N – Mechanical data
Symbol
millimeters
inches (1)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
-
-
1.750
-
-
0.0689
A1
0.100
-
0.250
0.0039
-
0.0098
A2
1.250
-
-
0.0492
-
-
b
0.280
-
0.480
0.0110
-
0.0189
c
0.100
-
0.230
0.0039
-
0.0091
D(2)
4.800
4.900
5.000
0.1890
0.1929
0.1969
E
5.800
6.000
6.200
0.2283
0.2362
0.2441
E1(3)
3.800
3.900
4.000
0.1496
0.1535
0.1575
e
-
1.270
-
-
0.0500
-
h
0.250
-
0.500
0.0098
-
0.0197
k
-
-
L
0.400
-
1.270
0.0157
-
0.0500
L1
-
1.040
-
-
0.0409
-
ccc
-
-
0.100
-
-
0.0039
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15 mm per side
3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per
side.
Note:
The package top may be smaller than the package bottom. Dimensions D and E1 are determinated at the
outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interleads flash,
but including any mismatch between the top and bottom of plastic body. Measurement side for mold flash,
protusions or gate burrs is bottom side.
M24M02-DR M24M02-R
SO8N package information
DS7025 - Rev 11
page 28/40



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