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M24M02-R 数据表(PDF) 34 Page - STMicroelectronics

部件名 M24M02-R
功能描述  2-Mbit serial I²C bus EEPROM
PDF  40 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

M24M02-R 数据表(HTML) 34 Page - STMicroelectronics

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Revision history
Table 19. Document revision history
Date
Revision
Changes
22-Dec-2010
1
Initial release.
09-Feb-2011
2
Updated:
•
Section 3.18:Read Identification Page
•
Section 3.19: Read thelock status
•
Figure 2: SO8 connections
•
Table 6: Absolute maximum ratings
•
Table 10: Input parameters
•
Table 11: DCcharacteristics
•
Table 12: AC characteristics at 400 kHz
•
Table 13: 1 MHz AC characteristics
Deleted:
•
Table 15: Available M24M02-xproducts(package, voltage range, frequency, temperature
grade)
09-Aug-2011
3
Updated Figure 5: MaximumRbus value versusbusparasitic capacitance (Cbus) for an I2C bus at
maximum frequency fC = 1 MHz and Table 11: DCcharacteristics.
07-Feb-2012
4
Updated:
•
Table 2: Device select code
•
Table 3: Most significant address byte
•
Table 4: Leastsignificant address byte.
•
Section 3.6: Write operations
•
Section 3.8: Page Write
25-Oct-2012
5
Updated document template and text (minor changes).
Cycling updated to 4 million cycles and data retention updated to 200 years.
Added WLCSP packages.
04-Jun-2013
6
Document reformatted.
Removed information related to thin WLCSP package. Updated:
•
WLCSP package silhouette on cover page
•
Section 1: Description
•
Figure 25: WLCSP connections
•
Note (1) under Table 14: Absolute maximum ratings.
Added Figure 57: WLCSP- 8-bump, 3.556 x 2.011 mm, wafer level chip scale package
recommended footprint
23-May-2014
7
removed note on page 7, Updated Table 5: Device select code, updated section numbering for
Section 5.2.4 and Section 5.2.6, updated note 1 on Table 30: Memory cell data retention, updated
Figure 57: WLCSP- 8-bump, 3.556 x2.011 mm, wafer level chip scale package recommended
footprint.
27-Jul-2015
8
Updated:
•
Figure 3 with note 1.
•
Table 2
•
Section 9.1: SO8N package information and Section 9.2: WLCSP package information
02-Mar-2017
9
Updated:
•
Figure 18: WLCSP-8-bump, 3.556 x 2.011 mm, wafer levelchip scale package recommended
footprint
Added:
•
Unsawn wafer on cover page
•
Table 18: Ordering information scheme (unsawn wafer)
M24M02-DR M24M02-R
DS7025 - Rev 11
page 34/40



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