STM32G0C1NET6XTR datasheet(155/159 Pages) STMICROELECTRONICS

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6.11

Thermal characteristics

The operating junction temperature TJ must never exceed the maximum given in

The maximum junction temperature in °C that the device can reach if respecting the

operating conditions, is:

TJ(max) = TA(max) + PD(max) x ΘJA

where:

•

TA(max) is the maximum operating ambient temperature in °C,

•

ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

•

PD = PINT + PI/O,

–PINT is power dissipation contribution from product of IDD and VDD

–PI/O is power dissipation contribution from output ports where:

PI/O = Σ (VOL × IOL) + Σ ((VDDIO1 – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high

level in the application.

6.11.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (still air). Available from www.jedec.org.

6.11.2

Selecting the product temperature range

The temperature range is specified in the ordering information scheme shown in Section 7:

Ordering information.

Table 24: General operating conditions

Table 93. Package thermal characteristics

Symbol

Parameter

Package

Value

Unit

Junction-

to-ambient

Junction-

to-board

Junction-

to-case

Thermal resistance

LQFP100 14 × 14 mm

°C/W

UFBGA100 7 × 7 mm

LQFP80 12 x 12 mm

LQFP64 10 × 10 mm

UFBGA64 5 × 5 mm

WLCSP52 3.09 × 3.15 mm

LQFP48 7 × 7 mm

UFQFPN48 7 × 7 mm

LQFP32 7 × 7 mm

UFQFPN32 5 × 5 mm

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