Philips Semiconductors

Product Specification Rev.3.0 December 2002

Bumped Wafer Specification

SL2 ICS 20

2

CONTENTS

1

SCOPE.......................................................................................................................................3

2

REFERENCE DOCUMENTS........................................................................................................3

2.1

Philips Documents.......................................................................................................................3

3

MECHANICAL SPECIFICATION ..................................................................................................3

3.1

Wafer..........................................................................................................................................3

3.2

Wafer Backside ...........................................................................................................................3

3.3

Chip Dimensions .........................................................................................................................3

3.4

Passivation..................................................................................................................................3

3.5

Au Bump.....................................................................................................................................3

4

FAIL-DIE IDENTIFICATION .........................................................................................................3

5

ORDERING INFORMATION ........................................................................................................3

5.1

Bumped die on sawn wafer ..........................................................................................................3

6

CHIP ORIENTATION AND BONDPAD LOCATIONS .....................................................................4

7

ELECTRICAL SPECIFICATIONS .................................................................................................5

7.1

ABSOLUTE MAXIMUM RATINGS

1, 2 ............................................................................................5

7.2

OPERATING CONDITIONS .........................................................................................................5

7.3

ELECTRICAL CHARACTERISTICS..............................................................................................6

8

FINAL WAFERTEST SPECIFICATION .........................................................................................7

9

HINTS FOR LABEL IC ENCAPSULATION....................................................................................8

9.1

Protection against Visible Light .....................................................................................................8

9.2

Protection against UV Light ..........................................................................................................8

9.3

Resistance to X-Rays ..................................................................................................................8

10

DEFINITIONS .............................................................................................................................9

11

DISCLAIMERS ............................................................................................................................9

11.1

Life support applications...............................................................................................................9

11.2

Licence Policy .............................................................................................................................9

12

REVISION HISTORY ................................................................................................................. 10