Philips Semiconductors

Product Specification Rev.3.0 December 2002

Bumped Wafer Specification

SL2 ICS 20

9

10 DEFINITIONS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be

published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress

above one or more of the limiting values may cause permanent damage to the device. These are stress

ratings only and operation of the device at these or at any other conditions above those given in the

Characteristics section of the specification is not implied. Exposure to limiting values for extended

periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

11 DISCLAIMERS

11.1 Life support applications

These products are not designed for use in life support appliances, devices, or systems where malfunction of

these products can reasonably be expected to result in personal injury. Philips customers using or selling

these products for use in such applications do so on their own risk and agree to fully indemnify Philips for

any damages resulting from such improper use or sale.

11.2 Licence Policy

Purchase of this Philips IC with a functionally according to ISO/IEC 15693 Standard does not convey an

implied license under any patent right on this standard. A license for the Philips portfolio of patents on the

ISO/IEC 15693 Standard can be obtained via the Philips Intellectual Property and Standards department.

For more information please contact the nearest Philips Semiconductors sales office.