80KSW0004 datasheet(42/48 Pages) RENESAS

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March 31, 2008

IDT80KSW0004

Datasheet

20 Package Specifications

Package Physical & Thermal Specifications

Package: Super FlipChip FCBGA (AR324)

Dimensions: 19 x 19 mm

Ball Count: 324

Ball Diameter: 0.6mm

Ball Pitch: 1.0mm

Estimated Theta JA = {18.2C/W @ 0m/s, 11.1 C/W @ 1m/s, 9.4 C/W @ 2m/s}

Estimated Theta JC = 0.2 C/W

VDD

1.2V Digital

Power (CMOS)

Digital VDD. All pins must be tied to single potential power supply

plane.

VDD3

3.3V Digital

Power (CMOS)

Digital Interface VDD. All pins must be tied to single potential

power supply plane.

VDDA

Analog Power

(CMOS)

Analog power. VDDS & VDDA may be tied to a common power

plane. VDD (core, digital supply) should have its own supply and

plane.

VDDS

SERDES Power

(CMOS)

Analog power for TX/RX pairs. VDDS & VDDA may be tied to a

common power plane. VDD (core, digital supply) should have its

own supply and plane.

Name

Function

Supply / Interface

Pin Function Description

Table 36 Pin Summary (Alphabetical)

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